CHALINE:Low friction, high sliding performance, anti-rattling, abrasion resistance, no bleeding, durability, fluorine replacement (PFAS replacement), flame retardant (V-0) and low-temperature toughness of PC resins, flame retardant subsidies for halogen-free blends, improved tactility, stain resistance Low dielectric polymers: low dielectricity, high heat resistance. Heat dissipation filler: heat dissipation, flowability Thermoplastic Elastomer:TPV,TPU,TPS,TPO,TPC Engineering plastics:PA,PC,POM,PET,PBT,PPS,m-PPE Low dielectric applications Semiconductor packaging, encapsulation materials, epoxy encapsulation materials, underfill materials, solder resists, interlayer insulation films, prepregs Heat dissipation Automotive/power device materials, etc. Epoxy, silicone, acrylic, etc.
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