From lightweighting and range extension in EVs, bionic joints in intelligent robots, to micron-level positioning in 6G communications and semiconductor packaging—high-performance plastics and rubber technologies have long shed their auxiliary label and are now defining ultimate product performance in the role of an "invisible chip."
EVs: Deep Lightweighting and Safety Protection
According to the Society of Automotive Engineers of China, in 2025, new energy vehicles achieved an average vehicle weight reduction of 120 kg through plastic lightweighting, with range increased by 65 km. To push the limits of weight reduction, Zhejiang Kaihua Moulds, with its microcellular foam injection molding mold technology, enables large plastic parts to achieve 15%-20% weight reduction while ensuring strength. On the safety front, Hangzhou JLS's eco-friendly halogen-free flame retardants have become core safety additives for power battery packs and high-voltage wiring harnesses. In intelligent cockpits, Sichuan Longhua Film's high-end composite functional films are widely used in large in-vehicle displays and touch panels.
Robotics & Low-Altitude Economy: Combining Rigidity and Flexibility, Empowering Equipment
As we enter the era of embodied intelligence and the low-altitude economy, robot joints and drone fuselages place stringent demands on materials: wear resistance, high toughness, and ultra-lightweight.
Major plastics and rubber players are demonstrating hardcore strength in this track. Miracll Chemicals' specialty TPU materials offer excellent wear, oil, and flex fatigue resistance for flexible joints. Kingfa Sci. & Tech. has achieved a major leap in high-end specialty plastics: its self-developed ultra-heat-resistant PEEK composites and modified polyamides are mass supplied to leading robotics companies for manufacturing critical load-bearing components like joints and skeletons, with component density over 30% lower than steel. Meanwhile, injection molding machine giants Yizumi and Borch provide equipment support for microcellular foaming, all-electric, and direct carbon fiber molding, greatly simplifying high-strength composite processing and accelerating mass production.
6G & Semiconductors: Breakthroughs in High-Frequency Materials and Precision Packaging
In the terahertz (THz) band for 6G communications, transmission rates can reach over 100 times those of 5G. RF components and antenna materials must possess near-limit "ultra-low dielectric constant and ultra-low dielectric loss."
In this field, Shandong Senrong (antenna substrate films) and China Bluestar Chengrand (high-frequency antenna resins for satellite communications) have entered the 6G supply chain with extremely low dielectric properties. Pret's LCP film products have successfully passed verification by leading consumer electronics customers and are mass-supplied for smartphone flexible board antennas; its in-house mass production capability will profoundly impact future 6G networks. In semiconductor packaging, Chen Hsong's Spark series all-electric injection molding machines are optimized for chip packaging and optical microstructures. With high repeatability and cleanroom operation, they build a solid foundation for equipment localization.
Chinese enterprises are collectively breaking through, using hardcore technology to ignite a new engine for global industrial upgrading and becoming unsung heroes behind the next-generation high-tech industry. CHINAPLAS 2027 will gather the world's leading plastics and rubber technology suppliers to bring you innovative technologies and premium alternative solutions.