Megatrends including circular economy, digital transformation, artificial intelligence, and supply chain restructuring are profoundly reshaping global manufacturing landscape. As an “industry barometer” for the global plastics and rubber industries,
CHINAPLAS 2027 officially unveils its new theme:
“Advancing a Smarter, Circular Future - As One”, marking its return to Shenzhen, the innovation hub of China, at the Shenzhen World Exhibition & Convention Center (Bao'an), PR China.
Seizing APEC Momentum to Unlock Global Opportunities With 2026 designated as the APEC "China Year" and Shenzhen hosting the 33rd APEC Economic Leaders' Meeting, the city’s value and international influence as a global hub for technology, high‑end manufacturing, commerce and trade continue to expand. Capitalizing on this momentum, CHINAPLAS 2027 leverages the strategic location of the Guangdong-Hong Kong-Macao Greater Bay Area to serve as an elevated platform for global trade and networking. Connecting over 4,700 international exhibitors and more than 300,000 professional visitors from around the world, the event facilitates face-to-face cross-border collaboration and supply chain resilience.
Smarter and Circular: Redefining Industry Value “Smarter” represents the deep integration of Artificial Intelligence (AI) into essential industrial processes, such as injection molding, extrusion, inspection, packaging and materials R&D, reshaping production efficiency, quality control, and cost management. “
Circular” focuses on powering innovation and industrial development in green and low-carbon technologies. Anchored by six defining trends — green development, intelligence, high-end advancement, functionality, integration and globalization, the exhibition CHINAPLAS continues to lead the transformation and upgrading of the plastics and rubber industries towards the higher end of the value chain, from plastics and rubber raw materials to machinery and equipment, and from innovative technology products to downstream application industries.
Rooted in Shenzhen's Innovation Hub: Driving Cross-Industry SynergiesShenzhen pushes to become the “world premier low-altitude economy city”, while unleashing powerful momentum in emerging and future industries, such as embodied AI robotics, semiconductors, and AI data centers. Serving as a civil-scale proving ground for pioneering technologies and products, Shenzhen enables accelerated market adoption and the rapid scaling of innovation. CHINAPLAS 2027 will harness this innovation ecosystem to speed up scenario-based validation and real-world deployment of plastics and rubber breakthroughs.
The show connects not only with established industries including automotive, packaging, electrical and electronics, building and infrastructure, and medical and healthcare, but also high-growth sectors, such as the low-altitude economy, embodied intelligence, AI data centers, and semiconductors, converting innovative achievements into new quality productive forces.
From exhibitors and exhibits to innovative technologies, concurrent events, and on-site services, CHINAPLAS 2027 is set to deliver an unprecedented experience and value to the industry. Professionals from plastics and rubber industries worldwide are warmly invited to gather in Shenzhen in April 13-16, 2027 for this flagship annual industry event.
Pre-register now!